We have a well equipped research facility to perform microstructural analysis on the electroplated copper and the substrate material. We also perform microhardness testing, tensile testing, adhesion testing, and short and long term testing of the thermal performance of the copper.
Electroplating Development Baths 5-50litres
Ultrasonic Cleaning Baths 1-50 litres
PurAir P20 Fume Cabinet
Polishing Facility: Single, Twin and 5 disc polishers.
Micrography: Olympus BX51M Microscope up to 1000x magnification.
Inspection: Brunel Microscope with Camera.
Hardness Tester: Buehler Micromet 5101
Tensile Tester: Tinius Olsen H25KT
Heat Treatment: Carbolite and LLG ovens, up to 250C
Adhesion Test Rig
Olympus BX51M for Metallurgy, and Brunel Microscope for Quality Inspection.
Tinius Olsen HK25T for tensile testing of electroplated copper samples.
Section of a copper rotor for microstructural analysis.
Fume Cabinet for Chemical Process Development.
Etched surface of A1 Titanium.
Electroplated copper has a fine grain size. Much smaller than cast or cold worked copper.
Heat Treated Copper showing annealing twins.
All pictures in this section taken by Wendy Chilton and Bob Chilton on our Olympus BX51M Microscope. Please enquire if you would like high resolution images or if you have specific request for copper microstructure examples we would be happy to help.