R A Chilton Ltd Copper Electroplating
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Research and Development

We have a well equipped research facility to perform microstructural analysis on the electroplated copper and the substrate material. We also perform microhardness testing, tensile testing, adhesion testing, and short and long term testing of the thermal performance of the copper.


Equipment

Polishing Facility: Single, Twin and 5 disc polishers.

Micrography: Olympus BX51M Microscope up to 1000x magnification.

Inspection: Brunel Microscope with Camera.

Hardness Tester: Buehler Micromet 5101

Tensile Tester: Tinius Olsen H25KT

Heat Treatment: Carbolite ovens, up to 250C

Adhesion Test Rig

Microscopes
image

Olympus BX51M for Metallurgy, and Brunel Microscope for Quality Inspection.



Tensile Testing
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Tinius Olsen HK25T for tensile testing of electroplated copper samples.

Sample Inspection
image

Section of a copper rotor for microstructural analysis.



Tinius Olsen HK25T
tinius olsen HK25T

Our tensile test machine. We have spare capacity on this machine, please enquire.

Microstructure
Fine Grain <0.001mm
copper micrograph

Electroplated copper has a fine grain size. Much smaller than cast or cold worked copper.

Annealed grains
copper micrograph

Heat Treated Copper showing annealing twins.

Micrography

All pictures in this section taken by Wendy Chilton and Bob Chilton on our Olympus BX51M Microscope. Please enquire if you would like high resolution images or if you have specific request for copper microstructure examples we would be happy to help.

Contact Us
R A Chilton Ltd

Unit 5 Tarvin Sands Industries
Barrow Lane
Tarvin
Chester
CH3 8JF
01829 749224